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Thermal Interface Materials

Thermal Conductive Gap Pad

Divided into GAP-PAD series、High Thermal Conductivity Series、High Strength Series、Low Density Series、Low Dielectric Series、Low Volatility Series、Non-Silicone Series、Carbon Fiber High Thermal Conductivity Series、Graphene Series、Thermal Conductive Absorbing Series.Used in smartphones, drones, smart wearable devices, network terminal equipment, communication equipment, power electronic equipment, laptops, automobiles, security, optical modules and other products.

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Thermal Gel

It is divided into single component non-curable series, single component curable series, dual component curable series, non-silicon series, and thermal conductive and wave-absorbing series. It is used in mobile communication equipment, desktop computers, portable computers and servers, LED lighting equipment, Printed circuit board components, housing connections, optical fiber communication equipment, automotive electronics, military electronics and other products.

Thermal Insulator Sheet

It is used in products in LED, IGBT, MOS tubes, power modules, optical modules, communication equipment, network terminals, data transmission, automotive electronics, consumer electronics, medical equipment, military equipment, aerospace and other fields.

Thermal Grease

Used inhigh-end computer processors CPU, graphics cards GPU, IGBT, LED, standard DC/DC power converters and DC/AC inverters, power modules, electronic communications and automotive electronics, etc.

Thermal Conductive Phase Change Material

Divided into GAP-PAD series、High Thermal Conductivity Series、High Strength Series、Low Density Series、Low Dielectric Series、Low Volatility Series、Non-Silicone Series、Carbon Fiber High Thermal Conductivity Series、Graphene Series、Thermal Conductive Absorbing SeriesUsed in smartphones, drones, smart wearable devices, network terminal equipment, communication equipment, power electronic equipment, laptops, auomobiles, security, optical modules and other products.