Thermal Conductive Gap Pad

Thermal Conductive Gap Pad

Versatile Thermal Conductive Gap Pad, available in various series to cater to diverse applications in smartphones, drones, network terminal equipment, automobiles, and more.

With a wide thermal conductivity range from 1 to 25W/mk, our Thermal Conductive Gap Pad ensures efficient heat transfer in compact electronic devices. Its soft, elastic, and compressible nature allows it to fully fill rough surfaces, reducing interface thermal resistance and providing effective buffering and shock-absorbing capabilities.

Our Thermal Conductive Gap Pad is reusable, easy to disassemble, and repair, offering convenience and cost-effectiveness in device maintenance. It can be compounded with materials like glass fiber, PI film, and insulation sheets to enhance strength, electrical insulation, and wear resistance.

Featuring excellent insulation performance, flame retardancy, and aging resistance, our Thermal Conductive Gap Pad operates reliably in a wide temperature range from -60°C to 250°C. It can be customized in different thicknesses and hardness levels to meet specific application requirements, and its specially treated base materials ensure optimal adhesion and die-cutting for seamless integration into various devices. Trust our Thermal Conductive Gap Pad to optimize thermal management and enhance the performance and longevity of your electronic products.

Features and Benefits

■ Thermal Conductivity 1-25W/m.k;

■ It can be used repeatedly and is easy to disassemble and repair;

■ Soft, elastic and compressible, it can fully fill rough surfaces, reduce interface thermal resistance and play a certain buffering and shock-absorbing role;

■ Can be compounded with glass fiber, PI film, insulation sheet, etc. to increase strength, electrical isolation and wear resistance;

■ Excellent insulation performance, flame retardant performance and aging performance, wide application temperature range, low temperature can reach -60℃, short-term high temperature can reach 250℃; different thicknesses/hardness can be designed according to application gap/stress requirements, and the base material can be specially treated (Such as detackification, tackification, etc. effects) and die-cutting of different sizes and shapes;