Thermal Conductive Sealant

Thermal Conductive Sealant

Thermal conductive sealant is a specialized adhesive compound designed to provide efficient heat transfer between two surfaces while also forming a reliable seal. It is commonly used in electronic and electrical applications where heat dissipation is crucial for optimal device performance and longevity.

One of the key features of thermal conductive sealant is its ability to fill gaps and irregularities between components, ensuring maximum surface contact for effective heat transfer. This helps to minimize thermal resistance and prevent the buildup of heat, which can lead to device malfunction or failure. Additionally, thermal conductive sealants are often formulated to have excellent adhesion properties, ensuring a strong and durable bond between the surfaces being sealed.

Thermal conductive sealants come in various forms, including pastes, gels, and tapes, allowing for flexibility in application depending on the specific requirements of the project. They are typically made from silicone or epoxy-based materials, which offer excellent thermal conductivity and stability over a wide range of temperatures.

In electronic devices such as CPUs, GPUs, and power converters, thermal conductive sealants are used to bond heat sinks, thermal pads, and other cooling components to the device's surface. This helps to dissipate heat generated during operation, preventing overheating and ensuring optimal performance. In addition to electronics, thermal conductive sealants are also used in automotive, aerospace, and industrial applications where efficient heat management is critical.

Thermal conductive sealants play a crucial role in maintaining the reliability and efficiency of electronic and electrical systems by facilitating effective heat transfer and ensuring a secure seal between components. Their versatility, reliability, and performance make them an essential component in a wide range of applications across various industries.

Features and Benefits

■ Thermal conductivity 0.5~3.0W/mk;

■ Good adhesion and no corrosion to the base material;

■ High bonding strength, up to 4.5MPa;

■ It has good temperature resistance after curing.